
SC16C850
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NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 11 November 2010
51 of 55
NXP Semiconductors
SC16C850
2.5 to 3.3 V UART with 128-byte FIFOs and IrDA encoder/decoder
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
13. Abbreviations
MSL: Moisture Sensitivity Level
Fig 25. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 41.
Abbreviations
Acronym
Description
CPU
Central Processing Unit
DLL
Divisor Latch LSB
DLM
Divisor Latch MSB
FIFO
First In, First Out
IrDA
Infrared Data Association
ISDN
Integrated Service Digital Network
LSB
Least Significant Bit
MSB
Most Significant Bit
PCB
Printed-Circuit Board
RoHS
Restriction of Hazardous Substances directive
UART
Universal Asynchronous Receiver/Transmitter